Electronics Rigid Flexible Printed Circuit Board for Telephone System
Quick Detail:
Name |
FPCB |
Material |
Cu: 1 oz PI: 1 mil |
Color |
Transparent,red,yellow, green,blue.Pink.,purple |
Surface treatment |
pure-tin plating |
Minimum hole dimension |
0.3mm |
Chemical resistance |
Meet IPC standard: |
Minimum linear width |
0.08mm |
Minimum linear distance |
0.08mm |
External tolerance |
+/-0.05mm |
Welding resistance |
280 more than 10 seconds |
Peeling Strength |
1.2kg/cm2 |
Heat resistance |
-200 to +300 degrees C |
Surface resistivity |
1.0*1011 |
Bandability: |
Meet IPC standard |
Description:
The main technical indicators
1. Max size: single sided, double sided:600mm * 500mm Multi-layer: 400mm * 600mm
2. Processing thickness:0.2mm -4.0mm
3 Copper foil substrate thickness: 18μ(1/ 2OZ ),35μ( 1OZ ),70μ( 2OZ )
4 Common material: FR-4 , CEM-3 , CEM-1, Polytetrachloroethylene,FR-1(94V0,94HB)
5. Light copper,Nickel-plated,Gilded,HAL;Immersion Gold,Antioxidant,HASL,Immersion Tin,etc.
Applications:
Our membrane switches are widely used in :
1.Medical Equipment
2.Telecommunications apparatus
3.Telephone systems
4.Household appliances
5.Security systems
6.Point of sale apparatus
7.Industrial controls
8.Access control systems.....
Company Advantage:
1) Top managers are experienced in the same field for many years.
2) Professional staff and workers.
3) Strong R&D capability
4) Quick Delivery
5) Competitive price
6) Two factories are available for large orders
7) Expert sales team and good customer service.
Specifications
Type |
PCB |
Application |
Electronic Products |
Color |
blue |
Feature |
Energy-efficient & Low power |
Machine Stiffness |
Rigid |
Lays |
Customized |
Material |
PET /PC |
I nsulation Material |
Organic resin |
I nsulation layer thichness |
General |
Antiflaming Speciality |
VO |
Processing Technic |
Rolled foil |
Reinforcing material |
Glass fiber |
Insulating Resin |
Polyimide resin |
Export Markets |
Global |
Process Capability
1. Drilling:The minimum diameter 0.1mm
2. Hole metallization:Minimum aperture 0.2mm,Thickness / aperture ratio 4:1
3. Wire width: Minimum:Gold plate 0.10mm, Tin plate0.1mm
4. Wire spacing: Minimum:Gold plate 0.10mm, Tin plate0.1mm
5. Gold plate: nickel layer thickness:≧2.5μ,Gold layer thickness: 0.05-0.1μm or according to customer requirements
6. HASL: tin layer thickness:≧2.5-5μ
7. Paneling: Line-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.15mm smallest form tolerance: ± 0.1mm
8. Socket chamfer: Angle: 30 degrees, 45 degrees, 60 degrees Depth: 1-3mm
9. V Cut: Angle: 30 degrees, 35 degrees, 45 degrees Depth: thickness 2/3 Minimum size: 80mm * 80mm