Flexible PCB Flexible Circuit Boards Double-Sided Printed Cable
High-performance flexible printed circuit boards designed for applications requiring superior flexibility, reliability, and space optimization.
Key Features & Benefits
- Exceptional Flexibility: Can be bent, folded, and deformed freely with small coil radius and movement along X, Y, Z axes
- Space Optimization: Light and thin design (average thickness 1.1-0.1mm) maximizes use of narrow instrument spaces
- Lightweight Construction: Weight optimized based on current load requirements rather than mechanical strength
- Superior Sealing Capability: Designed for low-tensile seal performance in adverse environments
- Stable Signal Transmission: Freely designed wiring patterns and conductor distances ensure steady R, L, C parameters
- Easy Assembly: Excellent terminal properties for soldering, inserting, riveting, and gluing applications
- Advanced Insulation: Materials like polyimide and polyester provide excellent insulation properties
Material Composition
Copper Foil Substrate: Electrolytic or rolled copper (common thicknesses: 1oz, 1/2oz, 1/3oz)
Substrate Film: Common thicknesses 1mil and 1/2mil
Cover Film Protection: Surface insulation with thicknesses of 1mil and 1/2mil
Stiffener: PI stiffener film for mechanical strength reinforcement (3mil to 9mil thickness)
EMI Shielding: Electromagnetic shielding film for interference protection
Applications
- Mobile Phones: Light weight and thin thickness save product volume, connecting battery, microphone, and buttons
- Computers & LCD Screens: Single-line configuration converts digital signals into display images
Technical Specifications
| Material |
PI: 1 mil, Cu: 1 oz, PI: 1 mil |
| Surface Treatment |
Pure-tin plating |
| Minimum Hole Dimension |
0.3mm |
| Minimum Linear Width/Distance |
0.08mm |
| External Tolerance |
+/-0.05mm |
| Welding Resistance |
280°C for more than 10 seconds |
| Peeling Strength |
1.2kg/cm² |
| Heat Resistance |
-200 to +300°C |
| Surface Resistivity |
1.0 × 10¹¹ |
| Bendability & Chemical Resistance |
Meets IPC standards |
Competitive Advantages
- Short Assembly Time: Complete line configuration saves extra wiring connection work
- Small Volume: Effectively reduces product volume for enhanced portability
- Light Weight: Lighter than rigid PCBs, reducing final product weight
- Thin Profile: Thinner than hard PCB boards, improving flexibility and 3D assembly
- Quick Delivery
- Best Services
- OEM/ODM Available
Membrane Switch Technical Specifications
| Wire Lead Resistance |
<1Ω/CM |
Life Time |
>1 Million times |
| Rated Current |
25-100mA, 0~30V DC |
Operation Temperature |
-104°F~158°F |
| Rated Voltage |
<50V, DC |
Operation Humidity |
at 104°F, <98% RH |
| Insulation Resistance |
<100MΩ, 250V DC |
Dome Springback Time |
<5 msec |
| Switch Travel |
Flat Type: 0.05-0.3mm Tactile Type: 0.3-1.5mm |
Base Material Voltage Withstand |
1500 V DC |
| Tail Flexibility |
Any angle within 180 degrees |
Product Images