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double-sided FPC circuit membrane
,flexible printing membrane switch
,printed FPC circuit switch
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Model NO.HC-FPC-002
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Combination ModeAdhesive Flexible Plate
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Conductive AdhesiveConductive Silver Paste
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Flame RetardantHB
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Processing TechnologyElectrolytic Foil
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Base MaterialAluminum
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Insulation MaterialsOrganic Resin
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Average Thickness1.1-0. Am
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Copper Foil TypeElectrolytic And Rolled
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Copper Foil Thickness1oz, 1/2oz, 1/3oz
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Substrate Film Thickness1mil, 1/2mil
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Cover Film Thickness1mil, 1/2mil
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Stiffener Thickness3mil To 9mil
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Production Capacity100,000PCS/Month
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HS Code8536500000
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Minimum Order Quantity100
Double-Sided Flexible Printing Membrane Printed FPC Circuit
Double-Sided Flexible Printing Membrane Printed FPC Circuit
Double-sided flexible printed circuit (FPC) boards offer exceptional flexibility and reliability for advanced electronic applications requiring compact, lightweight solutions.
Key Features and Benefits
- Exceptional Flexibility: Can be bent, folded, and deformed freely with small coil radius and movement along X, Y, Z axes
- Space-Saving Design: Light and thin construction (average thickness 1.1-0.1mm) maximizes use of narrow instrument spaces
- Lightweight Construction: Optimized for current load rather than mechanical strength, resulting in minimal weight
- Superior Sealing Capability: Designed for low-tensile seal performance in adverse environments
- Stable Signal Transmission: Freely designed wiring patterns and conductor distances ensure steady RLC parameters
- Easy Assembly: Excellent terminal properties for soldering, inserting, riveting, and gluing applications
- Enhanced Insulation: Materials like polyimide and polyester provide superior insulation properties
Material Composition
Copper Foil Substrate:
- Copper Foil: Electrolytic copper and rolled copper (common thickness: 1oz, 1/2oz, 1/3oz)
- Substrate Film: Common thickness of 1mil and 1/2mil
- Adhesive: Thickness customized to customer requirements
Cover Film Protection:
- Cover Film: Surface insulation (common thickness: 1mil and 1/2mil)
- Adhesive: Thickness customized to customer requirements
- Prevents adhesive buildup and foreign matter before pressing
Stiffener (PI Stiffener Film):
- Reinforces mechanical strength for surface mounting
- Common thickness: 3mil to 9mil
- Adhesive: Thickness customized to customer requirements
EMI Shielding: Electromagnetic shielding film protects circuit board lines from external interference in high electromagnetic environments.
Competitive Advantages
- Shorter Assembly Time: Complete line configuration eliminates extra PCB wiring connection work
- Compact Size: Small volume PCB effectively reduces product dimensions
- Lightweight: Significantly lighter than traditional rigid PCBs
- Thin Profile: Thinner than hard PCB boards, improving flexibility and 3D assembly capabilities
- Quick Delivery
- Premium Services
- OEM/ODM Customization Available
Application Images
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